NDLI: High-temperature storage and thermal shock studies of passive component attach materials

Content Provider	IEEE Xplore Digital Library
Author	Naefe, J.E. Johnson, R.W. Grzyvowski, R.R.
Copyright Year	1998
Description	Author affiliation: Dept. of Electr. Eng., Auburn Univ., AL, USA (Naefe, J.E.)
Abstract	In this work, the high temperature testing of passive component attach materials is reported. The target operating temperature for this research was 200/spl deg/C to 225/spl deg/C. The four materials chosen for the study were Ablestik (71-1) silver filled polyimide, EPO-TEK (E3081) silver-filled epoxy, Grace Specialty Polymers (CS6000) silver filled silicone, and Indalloy's (IND. 183) 88Au/12Ge eutectic solder. The two board materials selected for study were 96% alumina ceramic substrates and high temperature cyanate ester circuit boards. Resistors and capacitors were selected as the passive components. Since eutectic Sn/Pb solder terminations were unusable at these temperatures, end terminations for both the resistors and capacitors were Pd/Ag and Au. The test pattern was of a series resistor chain of eight 0-ohm resistors (120 mil/spl times/60 mil) and three independent 12 /spl mu/F ceramic multilayer capacitors (750 mil/spl times/650 mil). The storage temperatures selected were 175/spl deg/C, 250/spl deg/C, and 300/spl deg/C. The cyanate ester boards were tested in the 175/spl deg/C and 250/spl deg/C ambients, while the ceramic substrates were tested in the 250/spl deg/C and 300/spl deg/C environments. The polymer based component attach materials were tested at 175/spl deg/C and 250/spl deg/C, while the Au/Ge solder was tested at 300/spl deg/C. Thermal shock studies have been performed through 910 liquid to liquid cycles with a temperature range from -55/spl deg/C to 200/spl deg/C. Both Pd/Ag and Au terminated components on cyanate ester circuit boards and some ceramic substrates were included in these thermal shock rests.
Starting Page	68
Ending Page	78
File Size	995047
Page Count	11
File Format	PDF
ISBN	0780345401
DOI	10.1109/HITEC.1998.676763
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-06-14
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electric shock Temperature Ceramics Resistors Materials testing Capacitors Gold Circuit testing Silver Polymers
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Failure Mechanism of High Energy Surge Resistors

Reliability of flexible thin-film embedded resistors and electrical characterization of thin-film embedded capacitors and inductors

Thermal performance and reliability assessment of nano-sintered silver die attach materials

High-temperature storage and thermal cycling studies of Heraeus-Cermalloy thick film and Dale power wirewound resistors

Application and reliability analysis of sintered silver preforms for die attachment of wide bandgap devices

The influence of termination properties on the thermal shock and thermal cycle performance of surface mount multilayer ceramic capacitors

Reliability of multilayer ceramic capacitors after thermal shock

Low stress polymer die attach adhesive for plastic packages

High-temperature storage and thermal cycling studies of thick film and wirewound resistors

High-temperature storage and thermal shock studies of passive component attach materials

Similar Documents

Failure Mechanism of High Energy Surge Resistors

Reliability of flexible thin-film embedded resistors and electrical characterization of thin-film embedded capacitors and inductors

Thermal performance and reliability assessment of nano-sintered silver die attach materials

High-temperature storage and thermal cycling studies of Heraeus-Cermalloy thick film and Dale power wirewound resistors

Application and reliability analysis of sintered silver preforms for die attachment of wide bandgap devices

The influence of termination properties on the thermal shock and thermal cycle performance of surface mount multilayer ceramic capacitors

Reliability of multilayer ceramic capacitors after thermal shock

Low stress polymer die attach adhesive for plastic packages

High-temperature storage and thermal cycling studies of thick film and wirewound resistors

High-temperature storage and thermal shock studies of passive component attach materials