NDLI: Integrated silicon sensors: technology and microstructures

Content Provider	IEEE Xplore Digital Library
Author	Wise, K.D.
Copyright Year	1991
Description	Author affiliation: Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA (Wise, K.D.)
Abstract	The development of integrated sensor technology during the past decade, which has made possible the fabrication of a wide variety of microstructures on a high-volume basis, is discussed. Bulk micromachining is widely practiced using double-sided processes, while the single-sided dissolved-wafer bulk process offers advantages for many applications. Surface micromachining avoids the necessity of deep etching of the wafer bulk but requires careful control of stress in the deposited films and protection of the wafer during the sacrificial etch. Wafer-scale bonding processes such as electrostatic bonding and silicon fusion offer additional tools for the creation of three-dimensional microstructures. Electroforming processes such as LIGA allow structural thicknesses as great as 100 mu m with micron or submicron lateral features. The application of these processes and microstructures to neuroelectronic interfaces, mass flow and microflow sensors, and multichannel submicron surface profilometers is described. The extension of these approaches to complete integrated microsystems, realized monolithically or as multichip hybrids, is discussed, and applications in areas such as millimeter-wave components and vacuum microelectronics are examined.
Starting Page	412
Ending Page	424
File Size	894081
Page Count	13
File Format	PDF
ISBN	0780304918
DOI	10.1109/CORNEL.1991.170011
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1991-08-05
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Silicon Microstructure Micromachining Etching Fabrication Stress control Protection Bonding processes Electrostatics Wafer bonding
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Bulk silicon micro electro mechanical devices fabricated from commercial BESOI substrates

Fabrication of microstructures for modeling transport in porous materials

Wafer-to-wafer bonding for microstructure formation

Micromachined Sealed Cavities by Silicon Wafer Bonding for the Formation of Microstructures of Desired Thickness Using TMAH Etching

Silicon microstructures: Fabrication and application

Silicon microsensors and microstructures

A new silicon-on-glass process for integrated sensors

Mating and piercing micromechanical structures for surface bonding applications

Silicon Fusion Bonding and Deep Reactive Ion Etching a New Technology for Microstructures

Integrated silicon sensors: technology and microstructures

Similar Documents

Bulk silicon micro electro mechanical devices fabricated from commercial BESOI substrates

Fabrication of microstructures for modeling transport in porous materials

Wafer-to-wafer bonding for microstructure formation

Micromachined Sealed Cavities by Silicon Wafer Bonding for the Formation of Microstructures of Desired Thickness Using TMAH Etching

Silicon microstructures: Fabrication and application

Silicon microsensors and microstructures

A new silicon-on-glass process for integrated sensors

Mating and piercing micromechanical structures for surface bonding applications

Silicon Fusion Bonding and Deep Reactive Ion Etching a New Technology for Microstructures

Integrated silicon sensors: technology and microstructures