NDLI: Current status and future projections for EUV lithography

Content Provider	IEEE Xplore Digital Library
Author	Sweeney, D.W.
Copyright Year	2002
Description	Author affiliation: Lawrence Livermore Nat. Lab., CA, USA (Sweeney, D.W.)
Abstract	Extreme Ultraviolet Lithography (EUVL) at a 13nm wavelength is an extendable technology that will support IC manufacturing down to the 22nm node without using resolution enhancement techniques. Commercial tool throughput is specified to be greater than (80) 300mm wafers/hour for the 45nm node and beyond. Today, EUVL is entering the competitive commercialization process aimed at introduction of steppers and support technologies for the 45nm node in 2007. There are a number of key business and technical issues that will need to be resolved to meet this targeted introduction. In this talk we will identify key technical risks and compare the current technical capabilities to the commercial requirements. Considerable work is required in several areas. Of course, the final decision on any next generation lithography depends on the cost of ownership (CoO) of the technology and a willingness of suppliers and users to make investments in a timely manner. While these business and economic issues are not the topic of this talk, the technical issues discussed strongly impact the CoO and, in turn, the willingness of suppliers and users to make the required commitments.
Sponsorship	Japan Soc. Appl. Phys. IEEE Electron Device Soc
Starting Page	312
Ending Page	313
File Size	104518
Page Count	2
File Format	PDF
ISBN	4891140313
DOI	10.1109/IMNC.2002.1178668
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-11-06
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Lithography Ultraviolet sources Plasma sources Nonhomogeneous media Plasma applications Optical scattering Laboratories Fault location Throughput Business
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Intense short wavelength sources for EUV lithography and other applications

Progress and future directions of the US EUV lithography program

Current status of EUV lithography development in Japan

The droplet laser plasma source for EUV lithography

Sub-50-nm patterning in EUV lithography

Status of EUV lithography and plans in USA

Actinic mask inspection using EUV microscope

Recent activities in the development of EUV lithography at ASET

Development of the optical component for EUV phase-shift microscopes

Current status and future projections for EUV lithography

Similar Documents

Intense short wavelength sources for EUV lithography and other applications

Progress and future directions of the US EUV lithography program

Current status of EUV lithography development in Japan

The droplet laser plasma source for EUV lithography

Sub-50-nm patterning in EUV lithography

Status of EUV lithography and plans in USA

Actinic mask inspection using EUV microscope

Recent activities in the development of EUV lithography at ASET

Development of the optical component for EUV phase-shift microscopes

Current status and future projections for EUV lithography