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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Allen, M.G. |
| Copyright Year | 2003 |
| Description | Author affiliation: Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA (Allen, M.G.) |
| Abstract | MEMS technology can be utilized for the fabrication of magnetic structures in multiple frequency ranges, ranging from low-MHz metal-core devices for DC-DC converters to high-frequency dielectric or air core devices for RF application. They can also be fabricated in multiple locations: integral with silicon chips; in the interconnect layer between chip and board; and directly on the printed wiring board, in order to yield ultracompact magnetic microsystems. This payer describes examples of each of these fabrication approaches: high frequency dielectric-core inductors for CMOS power amplifiers integrated on chip; high-frequency air-core inductors fabricated within the interconnected layer between chip and board; and low-frequency metal-core inductors for DC-DC power conversion. |
| Sponsorship | Magnetics Soc. IEEE |
| File Size | 118438 |
| File Format | |
| ISBN | 0780376471 |
| DOI | 10.1109/INTMAG.2003.1230694 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2003-03-30 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Micromechanical devices Fabrication Radio frequency Inductors Frequency conversion DC-DC power converters Magnetic devices Dielectric devices Magnetic cores Silicon |
| Content Type | Text |
| Resource Type | Article |
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