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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Cunningham, J.E. Krishnamoorthy, A.V. Jan, W.Y. |
| Copyright Year | 2003 |
| Description | Author affiliation: AraLight Inc., Monroe Township, NJ, USA (Cunningham, J.E.; Krishnamoorthy, A.V.; Jan, W.Y.) |
| Abstract | This study reviews preliminary experimental data on accelerated aging test of VCSEL and detector arrays bonded to either silicon or SiGe application specific integrated circuits (ASICs). When compared with top emitting VCSEL (unbonded), results show that the flip chip bonding technology is more robust, reliable, and environmentally sound. In addition, technological benefits of 2-D array technology in terms of superior reliability over linear array solutions when scaling to high channel count is asserted. Moreover, reliability issues for modules are considered as the VCSEL data rate exceed 10 Gbs. |
| Starting Page | 156 |
| Ending Page | 157 |
| File Size | 150748 |
| Page Count | 2 |
| File Format | |
| ISBN | 0780378881 |
| ISSN | 10928081 |
| DOI | 10.1109/LEOS.2003.1251648 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2003-10-27 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Optical interconnections Vertical cavity surface emitting lasers Integrated circuit technology Circuit testing Bonding Integrated circuit reliability Accelerated aging Integrated circuit testing Detectors Sensor arrays |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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