NDLI: Optimum design methodology for thermally stable multi-finger power SiGe HBTs

Content Provider	IEEE Xplore Digital Library
Author	Jin, D.Y. Zhang, W.R. Guan, B.L. Chen, L. Hu, N. Xiao, Y. Wang, R.Q.
Copyright Year	2010
Description	Author affiliation: College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing, 100124, China (Jin, D.Y.; Zhang, W.R.; Guan, B.L.; Chen, L.; Hu, N.; Xiao, Y.; Wang, R.Q.)
Abstract	The two-dimensional temperature profile of a multi-finger power SiGe HBT is studied with the electrothermal model, which shows that there is an uneven temperature profile over the device finger for HBT with uniform finger length. Because of the positive current-temperature feedback, the uneven temperature profile will leads to an anomalous current distribution, which eventually caused the thermal instability. To improve the uneven temperature profile and enhance the thermal stability, the HBT with non-uniform finger length is designed. Considering that designing multiple finger length values becomes trivial and time-consuming for the HBT with dozens of emitter fingers, a new thermal design methodology namely Grouping and Adjusting (GA) method is proposed to shorten design time. Taking 30-finger HBT for example, a detailed design procedure is present. The calculated results show both significant improvement on the peak temperature and the uniformity of SiGe HBT with non-uniform finger length.
Starting Page	1
Ending Page	4
File Size	651832
Page Count	4
File Format	PDF
ISBN	9781424458660
e-ISBN	9781424458691
DOI	10.1109/IWJT.2010.5474901
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-05-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Design methodology Silicon germanium Germanium silicon alloys Heterojunction bipolar transistors Fingers Electrothermal effects Feedback Temperature distribution Current distribution Thermal stability
Content Type	Text
Resource Type	Article

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