NDLI: RC interconnect circuits and its balanced truncated models

Content Provider	IEEE Xplore Digital Library
Author	Baoguo Yuan Wang, B. Wang, S.-G.
Copyright Year	2004
Description	Author affiliation: Div. of Electr. & Electron. Eng., Shanghai Second Polytech. Univ., China (Baoguo Yuan)
Abstract	Advance of high-speed deep-submicron VLSI technology requires chip interconnect and packaging to be modeled by distributed circuits. Such a detailed modeling level eventually results in large scale linear circuits to be analyzed. Here, even distributed RC interconnect models and their closed-forms are discussed and presented. The obvious advantage is to avoid difficulty of taking very large dimension matrix inverse that exists in previous conventional methods. Then, the balanced truncation method is applied to two even distributed RC interconnect cases by using these closed-forms of the models. The results show that extremely high order RC interconnect can be high-accurately approximated by only the third or higher order balanced model. When the source and load ports are included, the whole model may be approximated by the second or the first order balanced model. Simulations are executed in both time and frequency domains. The results may be applied to VLSI interconnect model reduction and design.
Sponsorship	Zhejian Univ. Nat. Lab. of Ind. Control Technol. IEEE Robotics and Automation Soc. Nat. Natural Sci. Found. of China Chinese Assoc. of Automation
Starting Page	190
Ending Page	194
File Size	540947
Page Count	5
File Format	PDF
ISBN	0780382730
DOI	10.1109/WCICA.2004.1340554
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-06-15
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Integrated circuit interconnections Reduced order systems Very large scale integration Large-scale systems Linear circuits Circuit analysis Frequency domain analysis State-space methods Electronics packaging Circuit simulation
Content Type	Text
Resource Type	Article

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