NDLI: New failure mechanism during high temperature storage testing and its application on SIV risk evaluation

Content Provider	IEEE Xplore Digital Library
Author	Aubel, O. Yao, W. Meyer, M.A. Engelmann, H.J. Poppe, J. Feustel, F. Witt, C.
Copyright Year	2009
Description	Author affiliation: GLOBALFOUNDRIES, 1050 E. Arques Ave, Sunnyvale, CA 94085, USA (Yao, W.) \|\| GLOBALFOUNDRIES Dresden Module One LLC & Co. KG, Wilschdorfer Landstr. 101, 01109, Germany (Aubel, O.; Meyer, M.A.; Engelmann, H.J.; Poppe, J.; Feustel, F.) \|\| GLOBALFOUNDRIES, T.J. Watson Research Center, Yorktown Heights, NY, USA (Witt, C.)
Abstract	In this paper we showed results on high temperature storage tests performed on 90nm, 65nm and 45nm node material with different back end of line stacks. We have seen a strong impact of BEOL stack up on resistance traces of tests at temperature of over 250°C for 1000h. We found that the detected resistance increases are not related to stress migration phenomena but to changes in barrier integrity. The results suggest that the barrier is oxidizing due to oxygen supplied by the SiCOH ILD. First look into future technologies by adopted barrier processes simulating corresponding barrier thicknesses we see an acceleration of this results. Porous SiCOH which is used as baseline material for 45nm an beyond is even pronouncing this effect. This is definitely showing that this effect might become severe in future technologies.
Starting Page	5
Ending Page	10
File Size	1185089
Page Count	6
File Format	PDF
ISBN	9781424439218
ISSN	19308841
DOI	10.1109/IRWS.2009.5383044
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-10-18
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Failure analysis Thermal stresses Packaging Conductivity Wafer scale integration Electrical resistance measurement System testing Temperature distribution Ovens Electromigration
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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