NDLI: Ultrasonic contactless measurement with micromembranes

Content Provider	IEEE Xplore Digital Library
Author	Liebig, V. Kohler, B. Schomburg, W.K. Sarkar, M.R.
Copyright Year	1993
Description	Author affiliation: Dept. of Nondestructive Evaluation & Quality Assurance, Dresden, Germany (Liebig, V.; Kohler, B.)
Abstract	The resonance frequency of appropriately structured micromembranes is dependent on some parameters of the membrane itself and on the medium surrounding it. Two parameters, the temperature and strain, have been investigated in detail. The resonance frequency of mechanical vibrations of a membrane tightened across a frame depends among others on the internal mechanical tensile stress of this membrane. When the materials of membrane and frame are of different thermal expansion coefficients, the internal mechanical stress and thus the resonance frequency of the membrane and frame can be deduced from the resonance frequency. When microstructures are applied to a freely tightened membrane, it is subdivided into many equal micromembranes. When the parameters for manufacture and design of the membrane are appropriately chosen, the resonance frequency will be within the range of some megahertz so that it can be measured with the aid of ultrasonic methods. The sample principle applies to the detection of strain at the measuring point owing to the vibration of the internal tensile stress of the micromembrane. Ultrasonic contactless measurement of strain and temperature was experimentally verified based on these principles.
Starting Page	20
Ending Page	26
File Size	461301
Page Count	7
File Format	PDF
ISBN	0780312295
DOI	10.1109/IMTC.1993.382688
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1993-05-18
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Ultrasonic variables measurement Biomembranes Resonance Resonant frequency Strain measurement Temperature Tensile stress Vibration measurement Capacitive sensors Thermal expansion
Content Type	Text
Resource Type	Article

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