NDLI: Measuring the natural convective heat transfer coefficient at the surface of electronic components

Content Provider	IEEE Xplore Digital Library
Author	Hanreich, G. Nicolics, J.
Copyright Year	2001
Description	Author affiliation: Inst. of Ind. Electron. & Mater. Sci., Vienna Univ. of Technol., Austria (Hanreich, G.)
Abstract	Due to increasing power loss densities of electronic components an efficient thermal management is essential to minimize the influence of thermomechanically induced stress and thermal load. Frequently thermal simulation tools are applied to reduce the number of experiments needed for the thermal optimization of semiconductor components. However, a successful application of thermal simulation requires the implementation of well established thermal boundary conditions at the components' surfaces. It is well know that the natural convective heat transfer coefficient strongly depends on the respective surface dimensions. Empirical formulas cited in this context frequently do not suit the dimensions of a typical semiconductor component, since they were established for much larger objects. Accordingly, uncertainties are often related particularly to heat dissipation by natural convention. As a new approach in this work, a measurement procedure and an experimental set-up are presented which allow one to establish the heat transfer coefficient in the regime of natural convection directly at objects with a characteristic length in the range of electronic components. Experiments were carried out at vertical and horizontal surfaces with various form factors to consider their influence on the natural convection. The temperature dependence of the convection coefficients has been established between room temperature and 160/spl deg/C.
Sponsorship	IEEE Instrum. & Meas. Soc.
Starting Page	1045
Ending Page	1050
File Size	517490
Page Count	6
File Format	PDF
ISBN	0780366468
ISSN	10915281
DOI	10.1109/IMTC.2001.928239
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-05-21
Publisher Place	Hungary
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Heat transfer Thermal management of electronics Thermal stresses Electronic components Thermal loading Temperature dependence Energy management Thermal management Thermomechanical processes Boundary conditions
Content Type	Text
Resource Type	Article
Subject	Instrumentation Electrical and Electronic Engineering

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