NDLI: Overall Technological Results of IMS-EFSOT Japanese Project --- Environmental Impact of Lead-Free Soldering ---

Content Provider	IEEE Xplore Digital Library
Author	Okamoto, M. Serizawa, K. Satoh, H. Chiba, M. Takamatsu, T. Itsubo, N. Inaba, A.
Copyright Year	2005
Description	Author affiliation: Production Eng. Res. Lab., Hitachi Ltd., Ibaraki (Okamoto, M.; Serizawa, K.)
Abstract	As for lead-free solder, jointability (workability and joint reliability) is not only evaluated but also energy consumption i.e. CO $_{2}$ emission, toxicity, resource depletion, recyclability and reusability of various types of solder. Next it is attempted to integrate the environmental impacts of these factors of each solder and compare them among these solders. Finally some types of solder whose integrated environmental impact was assumed to be relatively low is recommended. Sn-Ag-Cu and Sn-Cu types of solder as the best solutions in the present state is recommended. That is, total environmental impact of these solders is minimum, although they have a problem of Ag and Sn scarce. Then, suggested it was necessary to construct recycling system of Ag and Sn in the long term. $2^{nd}$ Selection was Sn-Zn(-Bi) type solder. This solder has only problem about jointability. If this problem should be solved by improvement, this solder would be one of the best selections of lead-free solder. Furthermore refraining from use of Sb containing solder and In containing solder because of their toxicity and scarce respectively is proposed
Starting Page	554
Ending Page	558
File Size	2759213
Page Count	5
File Format	PDF
ISBN	1424400813
DOI	10.1109/ECODIM.2005.1619293
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-12-12
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Environmentally friendly manufacturing techniques Lead Soldering Bismuth Testing Recycling Electronic waste Research and development Tin Animals recycle lead-free solder environmental impact toxicity LCA LIME scarce
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Overview of IMS project; next generation environmental friendly soldering technology "EFSOT"

Examining the environmental impact of lead-free soldering alternatives

Examining the environmental impact of lead-free soldering alternatives

Reflow soldering evaluation of lead free solder alloys

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Microstructural coarsening of lead free solder joints during thermal cycling

Lead-free soldering - future aspects of toxicity, energy and resource consumption

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Overall Technological Results of IMS-EFSOT Japanese Project --- Environmental Impact of Lead-Free Soldering ---

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Overall Technological Results of IMS-EFSOT Japanese Project --- Environmental Impact of Lead-Free Soldering ---