NDLI: Manufacture of primary first wall panel prototypes for the ITER blanket shield modules

Content Provider	IEEE Xplore Digital Library
Author	Lorenzetto, P. Danner, W. Boudot, C. Bucci, P. Ioki, K. Tahtinen, S.
Copyright Year	2003
Description	Author affiliation: EFDA, Garching, Germany (Lorenzetto, P.; Danner, W.)
Abstract	A Research and Development programme for the ITER shield blanket has been implemented in Europe to provide input for the design and the manufacture of the full-scale production components. It involves in particular the fabrication and testing of mock-ups (small scale and medium scale) and prototypes of shields and primary first wall (PFW) panels. These prototypes aim at demonstrating the fabricability of the components. The PFW panels consist of a bi-metallic structure with a 316L stainless steel (SS) backing plate and a copper (Cu) alloy heat sink layer. There are two Cu alloy candidates: CuCrZr and CuAl25 alloys. Beryllium (Be) tiles are joined to the Cu alloy heat sink as plasma facing material. Two hot isostatic pressing (HIPping) methods are being considered in Europe for the fabrication of the bi-metallic structure of the PFW panels. With solid HIPping, the 316L SS backing plate, the Cu alloy plates and the 316L SS tubes are joined together with one single HIP cycle at 1040/spl deg/C. With powder HIPping, a first HIP cycle at 1100/spl deg/C is used to consolidate the 316L SS powder with embedded 316L SS tubes. A second HIP cycle at 1040/spl deg/C is then performed for consolidating and joining the CuCrZr powder. Beryllium tiles are then joined by HIPping or brazing; high temperature HIPping or furnace brazing for PFW panels with CuAl25 alloy heat sink material, and low temperature HIPping or inductive brazing for PFW panels with CuCrZr alloy heat sink material. Three full-scale panel prototypes have already been completed demonstrating the manufacturing feasibility of ITER PFW panels. Two more are under fabrication. All these panels will be thermal fatigue tested to confirm the good results already obtained with PFW mock-ups. This paper presents the fabrication route used for each panel prototype.
Starting Page	131
Ending Page	134
File Size	1016560
Page Count	4
File Format	PDF
ISBN	078037908X
DOI	10.1109/FUSION.2003.1426605
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2003-10-14
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Manufacturing Prototypes Copper alloys Fabrication Heat sinks Joining materials Hip Powders Europe Testing
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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