NDLI: A hands-on discussion of "dissection": coalitions lessons learned

Content Provider	IEEE Xplore Digital Library
Author	Agogino, A.
Copyright Year	1998
Description	Author affiliation: Coll. of Eng., California Univ., Berkeley, CA, USA (Agogino, A.)
Abstract	Summary form only given. A number of schools across the country associated with the NSF coalition program have incorporated the study of the artifacts and processes practised by others into their engineering undergraduate programs. Broadly labeled, this is "case-based learning". One "twist" to case-based learning has been to have the basis of the case study be the hardware itself: for example, Sheppard initiated a course in the fall of 1990 for freshman- and sophomore-level undergraduate engineering students called "Mechanical Dissection" with NSF Synthesis Coalition sponsorship. The course was created to help students become familiar with the machines/mechanisms that surround them in order to help them gain confidence in their ability to work with, build up and manipulate them. Another variation of the dissection approach is offered at North Carolina State in the "Product and Process Engineering Laboratory" where students dissect products while playing the roles of user, assembler and engineer, in series. Still another variation exists at UC-Berkeley, where students dissect products in conjunction with a multimedia case study that offers perspectives of the engineers who actually designed the product and explanations of design details. These and other variations of the "product dissection" approach to exposing students to hardware and design issues are demonstrated. A discussion on the advantages and limitations of this pedagogy is given.
Sponsorship	IEEE Educ. Soc.
File Size	87312
File Format	PDF
ISBN	0780347625
ISSN	01905848
DOI	10.1109/FIE.1998.738774
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-11-04
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Educational institutions Hardware Laboratories Engineering education Mechanical engineering Etching Educational programs Engineering students Assembly Multimedia systems
Content Type	Text
Resource Type	Article
Subject	Education Computer Science Applications Software

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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