NDLI: Design factors for atomic clocks for space

Content Provider	IEEE Xplore Digital Library
Author	Beard, R. Golding, W. White, J.
Copyright Year	2002
Description	Author affiliation: US Naval Res. Lab., Washington, DC, USA (Beard, R.; Golding, W.; White, J.)
Abstract	There are very strong differences between the designs of clocks for space applications and those used on Earth. This paper discusses the performance impacts from differences in mechanical design, thermal design, radiation hardness, and control. The design changes necessary to survive launch and operate in space go beyond the expected issues of mechanical strength and remote control. There are a number of design trade-offs that can affect clock performance. For example, the added structural members needed to secure a microwave cavity may result in poor thermal control due to heat loss along the structure or de-tuning due to new stresses on the cavity structure. Reliability and radiation hardening drive performance less directly by limiting the availability of critical electronic component types. On the positive side, the lack of gravity, fluctuations in air temperature, and mechanical perturbations sometimes lead to space clocks running better than similar ground units. The differences between clocks for short-term space experiments and production space vehicles are examined.
Sponsorship	IEEE Ultrasonics, Ferroelectrics, & Frequency Control Soc
Starting Page	493
Ending Page	498
File Size	581639
Page Count	6
File Format	PDF
ISBN	0780370821
DOI	10.1109/FREQ.2002.1075934
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-05-31
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Atomic clocks Thermal stresses Earth Electromagnetic heating Stress control Temperature control Radiation hardening Availability Electronic components Gravity
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Heat stress due to RF radiation

Thermal Conduction Switch for Thermal Management of Chip Scale Atomic Clocks

Flexible epoxy for low stress electronic component encapsulation

Thermophysiological Effects of Electromagnetic Radiation

ITER divertor cassette and PFC attachment structural design

Investigations of thermal and thermostress distributions in blanks at speed induction heating

Mechanisms for total dose sensitivity to preirradiation thermal stress in bipolar linear microcircuits

A Simple Evaporative System for Space-Environmental Thermal Control of Electronic Components

Solder process optimization: Influence of heating and cooling rate on the thermo-mechanical stress generated in components

Design factors for atomic clocks for space

Similar Documents

Heat stress due to RF radiation

Thermal Conduction Switch for Thermal Management of Chip Scale Atomic Clocks

Flexible epoxy for low stress electronic component encapsulation

Thermophysiological Effects of Electromagnetic Radiation

ITER divertor cassette and PFC attachment structural design

Investigations of thermal and thermostress distributions in blanks at speed induction heating

Mechanisms for total dose sensitivity to preirradiation thermal stress in bipolar linear microcircuits

A Simple Evaporative System for Space-Environmental Thermal Control of Electronic Components

Solder process optimization: Influence of heating and cooling rate on the thermo-mechanical stress generated in components

Design factors for atomic clocks for space