NDLI: FOUP N2 purge engineering in Fab

Content Provider	IEEE Xplore Digital Library
Author	Yiting Kuo Tsao, H. Tuung Luoh Ling-Wu Yang Tahone Yang Kuang-Chao Chen Chih-Yuan Lu
Copyright Year	2013
Description	Author affiliation: Technol. Dev. Center, Macronix Int. Co. Ltd., Hsinchu, Taiwan (Yiting Kuo; Tsao, H.; Tuung Luoh; Ling-Wu Yang; Tahone Yang; Kuang-Chao Chen; Chih-Yuan Lu)
Abstract	Airborne molecular contamination (AMC) becomes more serious in Fab as the device shrinks and wafer size increases, an economic way for preventing these contaminations is to use $N_{2}$ purge charging process. The practical FOUP $N_{2}$ purge engineering is addressed here, which includes the maintenance and management of FOUPs, $N_{2}$ purge charging flow rate, the design of nozzle, selection of nuzzle material, and tool configuration.
Sponsorship	IEEE Electron Devices Soc.
Starting Page	1
Ending Page	3
File Size	977678
Page Count	3
File Format	PDF
ISBN	9781479947096
DOI	10.1109/eMDC.2013.6756056
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-09-06
Publisher Place	Taiwan
Access Restriction	Subscribed
Rights Holder	Taiwan Semiconductor Industry Association
Subject Keyword	FOUP Contamination N2 Purge Condense Humidity AMC Etching
Content Type	Text
Resource Type	Article

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