NDLI: A hierarchic bonding procedure for the assembly of micro confocal microscope

Content Provider	IEEE Xplore Digital Library
Author	Jia, C. Fromel, J. Wiemer, M. Gessner, T. Bargiel, S. Passilly, N. Baranski, M. Gorecki, C.
Copyright Year	2012
Description	Author affiliation: Institute FEMTO-ST, CNRS UMR 6174, 16 route de Gray, Besancon, 25030 France (Bargiel, S.; Passilly, N.; Baranski, M.; Gorecki, C.) \|\| WPI-AIMR, Tohoku University 2-1-1 Katahira, Aoba-ku, Sendai, 980-8577 Japan (Fromel, J.) \|\| Fraunhofer Institute ENAS, Technology-Campus 3, Chemnitz, 09126 Germany (Jia, C.; Wiemer, M.; Gessner, T.)
Abstract	The construction of optical micro systems imposes new challenges on assembly technologies. These include the handling of multiple heterogeneous substrates, low thermal budget for the establishment of bonding connections, the accurate alignment of the substrates during wafer stacking and the integration of special components such as discrete optical lenses. In order to address these problems, a hierarchic wafer/component bonding process is proposed for the assembly of a 3-axis confocal scanning microscope. Experiment results indicate that the 9 constitutive components of the microscope, which are made from materials with different thermal expansion coefficients, can be joined together at less than 400°C global temperature. The strength of the achieved bonding is comparable to standard anodic or fusion bonding and can withstand diverse back-end-of-line processes such as dicing or grinding. Besides, the hermeticity of the developed bonding process is validated by monitoring the static deformation of a leak-indicating membrane.
Starting Page	187
Ending Page	189
File Size	2093176
Page Count	3
File Format	PDF
ISBN	9781467307437
e-ISBN	9781467307420
DOI	10.1109/LTB-3D.2012.6238087
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-05-22
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Wafer bonding Heterogeneous system integration Optical device fabrication Confocal microscope Microsystem technology Glass Silicon MOEMS Bonding Assembly Substrates Lenses
Content Type	Text
Resource Type	Article

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