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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Yongqiang Liu Shixi Yang Chunbiao Gan |
| Copyright Year | 2015 |
| Description | Author affiliation: Dept. of Mech. Eng., Zhejiang Univ., Hangzhou, China (Yongqiang Liu; Shixi Yang; Chunbiao Gan) |
| Abstract | Thickness measurement is highly useful in industrials both for controlling the thickness of the product and for material characterization considering both mechanical and chemical properties. Longitudinal ultrasonic velocity can be used to measure material thickness provided that sufficient accuracy can be achieved. A new laser ultrasonic thickness measurement method based on spectral analysis was proposed in this paper and was used for accurate thickness measurement for metal plate. A one-layer model was introduced which laser ultrasonic transmits into, deducing the expression of ultrasonic reflection coefficient amplitude spectrum (URCAS), from which we obtained the method for metal plate thickness measurement; then a laser ultrasonic system was set up to receive the laser ultrasonic transmitting into the plate. Meanwhile we developed a new laser ultrasonic data processing algorithm so that the frequency values of the peaks in frequency domain could be easily identified, then the velocity of the longitudinal ultrasonic could be calculated by the frequency difference of two adjacent peaks; finally, based on the velocity of the longitudinal ultrasonic and the experiment data the thickness of the metal plate could be calculated by inversion algorithm. The relative errors of the thickness measurement were below 0.66% for 5052 aluminum alloy; also we found that, the measurement of thickness is more accurate as the alloy thickness decreases. |
| Starting Page | 324 |
| Ending Page | 329 |
| File Size | 878726 |
| Page Count | 6 |
| File Format | |
| e-ISBN | 9781467379717 |
| DOI | 10.1109/URAI.2015.7358964 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2015-10-28 |
| Publisher Place | South Korea |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Date processing Ultrasonic variables measurement Frequency-domain analysis Metals Laser ultrasonic Acoustics Velocity measurement Thickness measurement Testing |
| Content Type | Text |
| Resource Type | Article |
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