Please wait, while we are loading the content...
Please wait, while we are loading the content...
| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Chen Zhonghua Li Benjun Guo Fengyi |
| Copyright Year | 2011 |
| Description | Author affiliation: Liaoning Technical University, Huludao, China (Chen Zhonghua; Li Benjun; Guo Fengyi) |
| Abstract | Contact interface temperature is an important factor that effect contact failure of sliding frictional couple. On the basis of the transient heat conduction theory and considering unstable conduction of heat, thermal convection of environment and thermal radiation, under the effect of Joule heat and frictional heat, a transient thermal model for copper wire/copper-dipped carbon panel of pantograph & catenary system was created based on 3D finite element method, which used to simulate what kind of factors can influence temperature rise of friction pairs. The distribution and features of the transient temperature field to plates were obtained as it working in normal operation, and the analysis results were compared with test data. The results show that within the limits of experimental error, the results of simulation can be in accordance with experiment conclusion. Electric current, velocity and normal force are the main factors which can influence the temperature rise. The coupled temperatures change with different electric currents and velocities were further studied, and under the constant displacement and normal force, the maximum coupled temperature increases with the increase of electric current and velocity; under the constant electric current and velocity, with the increase of normal force, the maximum coupled temperature decreases and then increases in the shape of “U”. |
| Starting Page | 612 |
| Ending Page | 616 |
| File Size | 442879 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781457712739 |
| e-ISBN | 9781457712722 |
| DOI | 10.1109/ICEPE-ST.2011.6123065 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-10-23 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Temperature measurement Sliding electrical contact Temperature Contacts Heating Wires Frictional heat Coupled temperature field Joule heat Finite element methods Current Finite element |
| Content Type | Text |
| Resource Type | Article |
National Digital Library of India (NDLI) is a virtual repository of learning resources which is not just a repository with search/browse facilities but provides a host of services for the learner community. It is sponsored and mentored by Ministry of Education, Government of India, through its National Mission on Education through Information and Communication Technology (NMEICT). Filtered and federated searching is employed to facilitate focused searching so that learners can find the right resource with least effort and in minimum time. NDLI provides user group-specific services such as Examination Preparatory for School and College students and job aspirants. Services for Researchers and general learners are also provided. NDLI is designed to hold content of any language and provides interface support for 10 most widely used Indian languages. It is built to provide support for all academic levels including researchers and life-long learners, all disciplines, all popular forms of access devices and differently-abled learners. It is designed to enable people to learn and prepare from best practices from all over the world and to facilitate researchers to perform inter-linked exploration from multiple sources. It is developed, operated and maintained from Indian Institute of Technology Kharagpur.
Learn more about this project from here.
NDLI is a conglomeration of freely available or institutionally contributed or donated or publisher managed contents. Almost all these contents are hosted and accessed from respective sources. The responsibility for authenticity, relevance, completeness, accuracy, reliability and suitability of these contents rests with the respective organization and NDLI has no responsibility or liability for these. Every effort is made to keep the NDLI portal up and running smoothly unless there are some unavoidable technical issues.
Ministry of Education, through its National Mission on Education through Information and Communication Technology (NMEICT), has sponsored and funded the National Digital Library of India (NDLI) project.
| Sl. | Authority | Responsibilities | Communication Details |
|---|---|---|---|
| 1 | Ministry of Education (GoI), Department of Higher Education |
Sanctioning Authority | https://www.education.gov.in/ict-initiatives |
| 2 | Indian Institute of Technology Kharagpur | Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project | https://www.iitkgp.ac.in |
| 3 | National Digital Library of India Office, Indian Institute of Technology Kharagpur | The administrative and infrastructural headquarters of the project | Dr. B. Sutradhar bsutra@ndl.gov.in |
| 4 | Project PI / Joint PI | Principal Investigator and Joint Principal Investigators of the project |
Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon |
| 5 | Website/Portal (Helpdesk) | Queries regarding NDLI and its services | support@ndl.gov.in |
| 6 | Contents and Copyright Issues | Queries related to content curation and copyright issues | content@ndl.gov.in |
| 7 | National Digital Library of India Club (NDLI Club) | Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach | clubsupport@ndl.gov.in |
| 8 | Digital Preservation Centre (DPC) | Assistance with digitizing and archiving copyright-free printed books | dpc@ndl.gov.in |
| 9 | IDR Setup or Support | Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops | idr@ndl.gov.in |
|
Loading...
|