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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Suwannatus, S. Pakdee, U. |
| Copyright Year | 2015 |
| Description | Author affiliation: Dept. of Phys., Kasetsart Univ., Bangkok, Thailand (Suwannatus, S.; Pakdee, U.) |
| Abstract | The homemade sputtering process was devised by a team of researchers. The copper bulk with nominal purity of 99.9% was used as a cathode target. Thin copper films were fabricated on glass slides by direct current sputtering (DC-sputtering) in vacuum chamber with base pressure of typically 10-2 mbar under argon gas (Ar). The effects of coated distances from cathode target to holder as 4, 7 and 10 cm on the morphology and crystallinity of thin Cu films were investigated. The system was designed and developed to improve the performance of coating thin film. A rotating holder was used as a supported function for the effective growth of the films. The holder was rotated with a constant angular speed of 30 rpm. The samples were examined with scanning electron microscope (SEM), atomic force microscope (AFM) and X-ray diffractometer (XRD). The experimental data revealed that the surface roughness and the crystallinity of thin copper films were improved by rotating function of a substrate holder. |
| Starting Page | 547 |
| Ending Page | 550 |
| File Size | 901747 |
| Page Count | 4 |
| File Format | |
| e-ISBN | 9781467376709 |
| DOI | 10.1109/TICST.2015.7369414 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2015-11-04 |
| Publisher Place | Thailand |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Rotating substrate holder Thin copper film Films Surface roughness Rough surfaces Copper Surface treatment Sputtering Substrates |
| Content Type | Text |
| Resource Type | Article |
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