NDLI: A new transport encapsulation for middlebox cooperation

Content Provider	IEEE Xplore Digital Library
Author	Trammell, B. Kuhlewind, M. Gubser, E. Hildebrand, J.
Copyright Year	2015
Description	Author affiliation: Cisco Syst., Inc., San Jose, CA, USA (Hildebrand, J.) \|\| Networked Syst. Group, ETH Zurich, Zurich, Switzerland (Trammell, B.; Kuhlewind, M.; Gubser, E.)
Abstract	Large-scale pervasive surveillance of Internet traffic has led to a rapidly expanding deployment of encryption. Network operators increasingly rely on the use of in-network functionality provided by middleboxes to make their networks manageable and economically viable. Emerging applications such as real-time video conferencing need further support that the transport layer, having become ossified between narrow interfaces and an inability to universally deploy new transports or new options, is unable to provide. To address the collision of these three forces, we present in this paper a new encapsulation and signalling protocol, called the Substrate Protocol for User Datagrams (SPUD), that provides a shim layer for middlebox cooperation. While the protocol itself must be standardized to allow for successful deployment and cooperation, in this paper we additionally assess research questions on how this new protocol can be used to expose information to middleboxes to enable low latency support for new services. We describe our approach based on a prototype implementation available to the community, and show through a small initial measurement study that the use of UDP as a multiplexing encapsulation for SPUD, which allows for NAT traversal as well as rapid deployment in userspace, is a valid strategy in the present Internet. Finally we discuss open issues and research challenges in SPUD's development as an input for both, the standardization community as well as for academic researchers.
Starting Page	187
Ending Page	192
File Size	427533
Page Count	6
File Format	PDF
ISBN	9781479989270
e-ISBN	9781479989287
DOI	10.1109/CSCN.2015.7390442
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-10-28
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Transport protocols Encapsulation Standardization Middleboxes Electron tubes
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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