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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Cheng Gao Haitian Liu Jiaoying Huang Shenglong Diao |
| Copyright Year | 2014 |
| Description | Author affiliation: Sch. of Reliability & Syst. Eng., Beihang Univ., Beijing, China (Cheng Gao; Haitian Liu; Jiaoying Huang; Shenglong Diao) |
| Abstract | DC/DC converters are widely used in industrial, aerospace and other fields. The reliability of DC/DC converters is very important for the whole electronic system. Overheat is the key factor infecting the reliability of DC/DC converters because of the power density of the device. Three-dimensional thermal analysis modules include heat distribution analysis and thermal stress analysis at 25 °C in this paper. In order to obtain power module temperature field contours at different temperature levels, a simplified 3D model of the power module was built, and steady-state thermal analysis was completed. The layout of the converter is optimized to reduce and balance heat distribution according to analysis results. The simulation results indicate that rational distribution of the power supply module can improve the reliability of DC/DC converters significantly. |
| Starting Page | 405 |
| Ending Page | 409 |
| File Size | 683115 |
| Page Count | 5 |
| File Format | |
| e-ISBN | 9781479979585 |
| DOI | 10.1109/PHM.2014.6988203 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2014-08-24 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Temperature distribution Heating Layout optimization Thermal analysis Steady-state Finite element analysis DC/DC converters Reliability Substrates Steady-state thermal analysis Load modeling |
| Content Type | Text |
| Resource Type | Article |
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