NDLI: TempLab: A testbed infrastructure to study the impact of temperature on wireless sensor networks

Content Provider	IEEE Xplore Digital Library
Author	Boano, C.A. Zuniga, M. Brown, J. Roedig, U. Keppitiyagama, C. Romer, K.
Copyright Year	2014
Description	Author affiliation: Inst. for Tech. Inf., Graz Univ. of Technol., Graz, Austria (Boano, C.A.; Romer, K.) \|\| Embedded Software Group, Delft Univ. of Technol., Delft, Netherlands (Zuniga, M.) \|\| Sch. of Comput. & Commun., Lancaster Univ., Lancaster, UK (Brown, J.; Roedig, U.) \|\| SICS Swedish ICT, Kista, Sweden (Keppitiyagama, C.)
Abstract	Temperature has a strong impact on the operations of all electrical and electronic components. In wireless sensor nodes, temperature variations can lead to loss of synchronization, degradation of the link quality, or early battery depletion, and can therefore affect key network metrics such as throughput, delay, and lifetime. Considering that most outdoor deployments are exposed to strong temperature variations across time and space, a deep understanding of how temperature affects network protocols is fundamental to comprehend flaws in their design and to improve their performance. Existing testbed infrastructures, however, do not allow to systematically study the impact of temperature on wireless sensor networks. In this paper we present TempLab, an extension for wireless sensor network testbeds that allows to control the on-board temperature of sensor nodes and to study the effects of temperature variations on the network performance in a precise and repeatable fashion. TempLab can accurately reproduce traces recorded in outdoor environments with fine granularity, while minimizing the hardware costs and configuration overhead. We use TempLab to analyse the detrimental effects of temperature variations (i) on processing performance, (ii) on a tree routing protocol, and (iii) on CSMA-based MAC protocols, deriving insights that would have not been revealed using existing testbed installations.
Starting Page	95
Ending Page	106
File Size	1680938
Page Count	12
File Format	PDF
ISBN	9781479931460
e-ISBN	9781479931477
DOI	10.1109/IPSN.2014.6846744
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-04-15
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature sensors Temperature measurement Protocol Performance Testbed Wireless sensor networks Temperature distribution TempLab Temperature Heating CSMA Wireless Sensor Networks RPL
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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