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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Eunseok Song Hongseok Kim Kim, J.J. Chiuk Song Hyunsuk Lee Joungho Kim |
| Copyright Year | 2014 |
| Description | Author affiliation: Dept. of Electr. Eng., KAIST, Daejeon, South Korea (Eunseok Song; Hongseok Kim; Kim, J.J.; Chiuk Song; Hyunsuk Lee; Joungho Kim) |
| Abstract | Design challenges in 3D packages, which represent a system bandwidth of Tera Byte/sec, include serious SSN and large system area burden. For overcoming such design challenges, a package-level WPT scheme is proposed. Also, a proper inductor structure for 3D packages is proposed and verified through measuring the power efficiency of the WPT scheme according to inductor types. The WPT scheme in 3D packages that uses magnetic field resonance shows a noise filtering characteristic that significantly reduces power noise. In addition, the WPT system can reduce system area burden, as we can get rid of power interconnections, such as power balls and power TSVs, in 3D package/ICs based on its WPT scheme. |
| Sponsorship | IEEE Microwv. Theory Tech. Soc. |
| Starting Page | 178 |
| Ending Page | 181 |
| File Size | 700700 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781479929238 |
| DOI | 10.1109/WPT.2014.6839576 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2014-05-08 |
| Publisher Place | South Korea |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Voltage measurement Magnetic field resonance Noise Power noise Inductor design Inductors System area burden 3D package Three-dimensional displays Magnetic field measurement Bandwidth Wireless power transfer Pins Power efficiency |
| Content Type | Text |
| Resource Type | Article |
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