NDLI: Improvement of side-wall roughness in deep glass etched MEMS vibratory sensors

Content Provider	IEEE Xplore Digital Library
Author	Ahamed, M.J. Senkal, D. Shkel, A.M.
Copyright Year	2014
Description	Author affiliation: Microsyst. Lab., Univ. of California, Irvine, Irvine, CA, USA (Ahamed, M.J.; Senkal, D.; Shkel, A.M.)
Abstract	In this paper we report an optimized post-fabrication annealing process for improvement of sidewall roughness in deep glass etched resonant MEMS devices. The method utilizes thermal-reflow behavior of glass and does not require chemical or mechanical treatment. Experiments were conducted to explore the trade-off space between roughness improvement and structural deformation by varying temperature from 300 °C to 900 °c and duration from 2 to 240 minutes. The optimal results were obtained at 700 °C for 30 minutes, resulting in an 10x improvement in roughness from 900 nm Ra to 85 nm Ra and low feature deformation of <;10%. The method was successfully utilized in deep glass etching of micro-glassblown wineglass resonators, which resulted in very low side wall roughness and sub-hz frequency symmetry.
Sponsorship	IEEE Sensors Counc.
Starting Page	1
Ending Page	2
File Size	2248247
Page Count	2
File Format	PDF
ISBN	9781479909162
DOI	10.1109/ISISS.2014.6782531
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-02-25
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Annealing Surface morphology Glass Gyroscope Etching Surface roughness Post-fabrication annealing Rough surfaces Deep glass dry etching Roughness reduction Micro hemispherical resonator
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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