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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Niehenke, E.D. Sacks, F.E. Kline, M.D. Simon, A. Luce, W. |
| Copyright Year | 1990 |
| Description | Author affiliation: Westinghouse Electric Corp., Baltimore, MD, USA (Niehenke, E.D.; Sacks, F.E.; Kline, M.D.; Simon, A.; Luce, W.) |
| Abstract | Summary form only given. A new innovative package design using a common RF, DC, and logic carrier with a formed lid structure has been developed for batch processing. Aluminum-silicon composite housings under development offer improved thermal conductivity, lighter weight, lower cost, and the potential of direct attachment of GaAs chips to the housing. Substrate technologies include glass-on-silicon RF substrates which significantly reduce the module part count. A four-to-one reduction in part count and cost was achieved in an RF receiver subassembly using a single substrate and thin-film passive element deposition with this technology. Cofired multilayer ceramic substrates were developed to incorporate logic, power conditions, and RF circuitry. Technologies developed for assemblies include high-precision chip component pick-and-place, automated epoxy chip attachment techniques, and void-free solder attachment using a vacuum system. Vacuum pick-up techniques were developed for the pick-and-place assembly of GaAs MMIC chips to eliminate negative yield factors. Power MMIC chips were effectively soldered with the void-free solder attachment. Highly automated testing techniques have been developed for rapid measurement of pulsed large- and small-signal S-parameters, high dynamic range automated spurious checks, and full S-parameter characterization for all amplitude and phase module settings.<> |
| File Size | 44852 |
| File Format | |
| DOI | 10.1109/GAAS.1990.175456 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1990-10-07 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Radio frequency Costs Pulse measurements Gallium arsenide Vacuum technology Packaging MMICs Thermal conductivity Manufacturing Substrates |
| Content Type | Text |
| Resource Type | Article |
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