NDLI: Optimizing laser soldering of SMD components: From theory to practice

Content Provider	IEEE Xplore Digital Library
Author	Bunea, R. Svasta, P. Illyefalvi-Vitez, Z. Batorfi, R. Geczy, A.
Copyright Year	2011
Description	Author affiliation: Politehnica University of Bucharest Romania, Center for Technological Electronics and Interconnection Techniques, UPB-CETTI, Bucharest, Romania (Bunea, R.; Svasta, P.) \|\| Budapest University of Technology and Economics (BME), Department of Electronics Technology (BME-ETT), Budapest, Hungary (Illyefalvi-Vitez, Z.; Batorfi, R.; Geczy, A.)
Abstract	The paper presents the results of a study of the procedure of laser soldering chip SMD components, taking into consideration various parameters of the soldering process: type and quantity of solder paste used, energy pumped into the system, etc. There are many situations in modern electronics where the heat for soldering must be controlled very accurately, for example for soldering temperature sensitive components or using different substrates that require a soldering temperature different than the usual ones (PMMA substrates need low temperature soldering). We studied the energy necessary for realizing high quality solder joints even from the first soldering, thus reducing the number of destroyed samples and decreasing the time and costs of development of the electronic module. Based on the theoretical model, we soldered components and performed electrical and mechanical tests, cross-sections, optical and X-ray inspections.
Starting Page	55
Ending Page	58
File Size	769341
Page Count	4
File Format	PDF
ISBN	9781457712760
e-ISBN	9781457712777
e-ISBN	9781457712753
DOI	10.1109/SIITME.2011.6102685
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-10-20
Publisher Place	Romania
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Laser theory Laser soldering Low temperature soldering Heating Apertures Laser modes 4P model Soldering Substrates
Content Type	Text
Resource Type	Article

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