NDLI: Stencil deformation during stencil printing

Content Provider	IEEE Xplore Digital Library
Author	Krammer, O. Molnar, L.-M. Jakab, L. Klein, C.
Copyright Year	2009
Description	Author affiliation: Automotive Electronics, Engineering Assembly and Interconnect Technology, Robert Bosch GmbH, Stuttgart, Germany (Klein, C.) \|\| Department of Electronics Technology, Budapest University of Technology and Economics, Hungary (Krammer, O.; Molnar, L.-M.; Jakab, L.)
Abstract	Uneven solder mask thickness or other artifacts on PCBs can keep the stencil away from the PCB during stencil printing, which cause large deposited solder paste volume, and can result in solder bridges after reflow soldering. In our experiment we have investigated the deformation properties of stencils. The load-strain curve of a 125 µm thick stainless steel stencil was measured on nine locations. By the deformation experiments, the FEM (Finite Element Method) model of the stencil was created. With FEM simulations, the minimum technological distances (distance between artifacts and solder pads) for a range of step heights (difference between artifact height and pad height) and for different stencil thicknesses were determined. With the adherence to this technological distance, the stencil can bend down to the pad, and the proper amount of solder paste can be deposited onto the pad.
Starting Page	179
Ending Page	184
File Size	1100675
Page Count	6
File Format	PDF
ISBN	9781424451326
DOI	10.1109/SIITME.2009.5407378
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-09-17
Publisher Place	Hungary
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Printing Semiconductor device modeling Bridge circuits Apertures Automotive electronics Assembly Reflow soldering Thickness measurement Clocks Electronics packaging
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
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3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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