NDLI: Assessment of the reliability of the solder joints of the ultra-fine-pitch FCBGA

Content Provider	IEEE Xplore Digital Library
Author	Joong-Soon Jang Kitae Kim Kihoon Yoo Kang-Dong Kim Jong-Min Kim Hyong-Rok Lee Sang-Won Lee
Copyright Year	2012
Description	Author affiliation: Graduate School of Industrial Engineering, Ajou University, Suwon, Korea (Joong-Soon Jang; Kitae Kim; Kihoon Yoo) \|\| Reliability Lab, Samsung Electro-Mechanics, Suwon, Korea (Kang-Dong Kim; Jong-Min Kim; Hyong-Rok Lee; Sang-Won Lee)
Abstract	In this study, reliability assessment of the IMC layer of the ultra-fine-pitch FC-BGA(Flip-Chip Ball Grid Array) is conducted. The samples are prepared to reveal the differences in the adhesion forces of the IMC layer by dissimilarly establishing each plating thickness for surface finish(Ni/Pd/Au). The hardness and thickness of a P-rich Ni layer, which is known as the weakest section in ENPIG surface, are measured using the nano-indentation and TEM analysis. The degree of adhesion of the IMC layer under each experimental condition is evaluated and the metal plate shear test is performed for verification. The results showed significant correlations between the hardness and thickness of the IMC later and the high fraction defectives of the brittle fractures whose IMC layer had low hardness.
Starting Page	798
Ending Page	801
File Size	1442290
Page Count	4
File Format	PDF
ISBN	9781467307864
e-ISBN	9781467307888
DOI	10.1109/ICQR2MSE.2012.6246349
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-06-15
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Shear test Gold Correlation Adhesives Nano-indentation Brittle frracture Nickel IMC layer Reliability Soldering
Content Type	Text
Resource Type	Article

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