NDLI: Heating effect of a one-dimensional molecular assembly on self-repairing capability in the nanoscopic channels of mesoporous silica

Content Provider	IEEE Xplore Digital Library
Author	Lintang, H.O. Kinbara, K. Yamashita, T. Aida, T.
Copyright Year	2010
Description	Author affiliation: Department of Chemistry and Biotechnology, School of Engineering and Center for NanoBio Integration, The University of Tokyo, Japan (Lintang, H.O.; Kinbara, K.; Aida, T.) \|\| Department of Pure and Applied Chemistry, Faculty of Science and Technology, Tokyo University of Science, Japan (Yamashita, T.)
Abstract	Self-repairable optoelectronic devices from a heat-induced structural damaged are potentially important for sensor [1] and display [2] applications. Recently, self-healing phenomena have attracted particular attention for developing sustainable structural materials [3], where extensive studies have been reported on polymeric materials capable of autonomous repairing macroscopic fractures or restoration lost mechanical strengths [4, 5]. On the other hand, for exploiting molecular devices that can self-repair elaborate functions, one may encounter different problems originating from much smaller size regimes. However, no rational strategies have yet been proposed for addressing this challenging issue. In our previous paper, when a phosphorescent columnar assembly of trinuclear gold(I) pyrazolate complex [Au3Pz3] is confined in the nanoscopic channel of hexagonal mesoporous silica [Au3Pz3]/silicahex (Fig. 1), upon stepwise heating from 20 °C to 140 °C in 45 min, the one-dimensional molecular assemblies are not only protected from thermal disruption but also strongly encouraged to self-recover to 100% in 5 h from a heat-induced structural damaged [6].
Starting Page	1
Ending Page	2
File Size	420568
Page Count	2
File Format	PDF
ISBN	9781424488537
e-ISBN	9781424488544
DOI	10.1109/ESCINANO.2010.5700970
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-12-01
Publisher Place	Malaysia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Heating
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
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