NDLI: An Improved LIEP Method Utilizing Electrothermal Technology

Content Provider	IEEE Xplore Digital Library
Author	Qiaoling Ji Yi Jiang Xiaowei Ji
Copyright Year	2010
Abstract	Laser Induced Electroless Plating(LIEP) has many advantages such as homogeneous microstructure, relatively low cost, feasibility to be applied on non-metal substrates and operated at room temperature with relative simple equipment, and thus received much attentions in flexible circuit making. But the wide application of LIEP is also limited by poor accuracy, low speed and low repeatability brought by the temperature, concentration, thickness of plating solution. An improved approach is proposed in this paper aiming at enhancing the Laser Induced Electroless plating on the fabric utilizing the AC electrothermal technology. A mathematical model is also established and the simulation is carried out. The results show that it is not only effective and feasible, but also capable of minimizing the pollution greatly, and thus of great convenience for future micro electro mechanical systems and its microfabraction.
Starting Page	217
Ending Page	220
File Size	393767
Page Count	4
File Format	PDF
ISBN	9781424486830
DOI	10.1109/ICOIP.2010.305
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-11-11
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electrodes Flexible circuit Fluids Microfabraction Electrothermal technology Mathematical model Electric fields Equations Substrates Laser Induced Electroless Plating i LIEPj
Content Type	Text
Resource Type	Article

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