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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Puqi Ning Wang, F. Khai Ngo |
| Copyright Year | 2011 |
| Description | Author affiliation: Power Electronics & Electric Power Systems Research Center, Oak Ridge National Laboratory, Knoxville, TN, USA (Puqi Ning) || Center for Power Electronics Systems, Virginia Polytechnic Institute and State University, Blacksburg, USA (Wang, F.) || Department of Electrical Engineering and Computer Science, The University of Tennessee, Knoxville, USA (Khai Ngo) |
| Abstract | This study confirms that high stresses between the metallization layer and ceramic lead to significant failures in DBC substrate. The driving forces behind several different failure modes are discussed. Further understanding of these failure mechanisms enables the modules to be engineered for longtime operation and helps to enhance the reliability of system-level operation. |
| Starting Page | 319 |
| Ending Page | 324 |
| File Size | 607601 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781457705427 |
| e-ISBN | 9781457705410 |
| DOI | 10.1109/ECCE.2011.6063786 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-09-17 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Simulation Copper Reliability Finite element methods Substrates Stress Aluminum oxide |
| Content Type | Text |
| Resource Type | Article |
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