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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Chun-Kai Liu Yu-Lin Chao June-Chien Chang Wei Li Chih-Ming Tzeng Rong-Chang Fang Kuo-Shu Kao Tao-Chih Chang Chang-Sheng Chen Ming-Kan Liang Wei-Chung Lo |
| Copyright Year | 2013 |
| Description | Author affiliation: Electron. & Opto-Electron. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan (Chun-Kai Liu; Yu-Lin Chao; June-Chien Chang; Wei Li; Chih-Ming Tzeng; Rong-Chang Fang; Kuo-Shu Kao; Tao-Chih Chang; Chang-Sheng Chen; Ming-Kan Liang; Wei-Chung Lo) |
| Abstract | Insulated gate bipolar transistor (IGBT) power modules are widely used in household, industry and vehicle applications due to the features of higher efficiency, smaller size, low cost and higher reliability. However, the large power dissipation of IGBT and diode chips and harsh application environment of vehicle, reliability is an important issue. In this paper, the 600V, 450A IGBT power module packaging technologies for 50kW electrical vehicle (EV) are developed and verified. The integrated electrical, thermal, and stress design is established. Module assembly technologies include chip on direct bond copper (DBC) substrate bonding, DBC substrate on base plate bonding, heavy Al wire bonding are developed. Finally, the performance of power module is verified by module testing, system platform testing and EV vehicle testing. The results show that the IGBT power modules have good performance and successfully pass through the system platform and EV vehicle tests. |
| Sponsorship | IEEE Power Electron. Soc. |
| Starting Page | 1 |
| Ending Page | 5 |
| File Size | 1343700 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781479906925 |
| DOI | 10.1109/PEDG.2013.6785626 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-07-08 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Insulated gate bipolar transistors Resistance Thermal resistance Wires Multichip modules Electric vehicle Direct bond copper Reliability IGBT power module Bonding Vehicles |
| Content Type | Text |
| Resource Type | Article |
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