NDLI: The design of a vector hydrophone's chip-level damping structure

Content Provider	IEEE Xplore Digital Library
Author	Xibao Liu Guojun Zhang Linggang Guan Liangxia Yan Chenyang Xue
Copyright Year	2011
Description	Author affiliation: Science and Technology on Electronic Test & Measurement Laboratory, North University of China, NUC, Taiyuan, China (Xibao Liu; Guojun Zhang; Linggang Guan; Liangxia Yan; Chenyang Xue)
Abstract	A novel damping spring structure is designed based on the existing structure of MEMS vector hydrophone. It is desirable that this novel structure can improve the antinoise ability of hydrophone. According to finite element simulation by Ansys, the geometry, stiffness and location of the spring are determined. Two pairs of spring are adopted and placed inside and outside vertically. Simulation results show that the reducing flow noise ability of this damping structure can be increased by 3 times, as well as it does not affect the sensitivity of hydrophone. The advantages of this chip-level spring damping structure are one integrated, good consistency and engineering applications.
Starting Page	358
Ending Page	360
File Size	165535
Page Count	3
File Format	PDF
ISBN	9781612848396
e-ISBN	9781612848402
DOI	10.1109/ICCRD.2011.5763922
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-03-11
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Damping Electric shock Noise Sonar equipment Acoustic beams Vector hydrophone Spring Springs Stress Coefficient of stiffness
Content Type	Text
Resource Type	Article

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