NDLI: Advanced low-cost bare-die packaging technology for liquid crystal displays

Content Provider	IEEE Xplore Digital Library
Author	Hwang, J.C.
Copyright Year	1994
Description	Author affiliation: Nicroelectron. & Comput. Technol. Corp., MCC, Austin, TX, USA (Hwang, J.C.)
Abstract	Packaging technology for FPD (flat panel display) drivers has evolved from TAB (tape automated bonding) to COG (chip-on-glass) for size, cost, and performance reasons. COG supports demands for increased display sizes, pixel counts, and gray levels, as well as for reduced power consumption. It is also considered the most promising candidate for next-generation LCD packaging because the reduction in bonding steps lowers cost and increases reliability. COG packaging bonds bare IC driver chips directly to the panel electrodes, thus reducing materials requirements and production costs. The current advanced COG mounting technology for LCD (liquid crystal display) panels includes the pressure welding method, the conductive paste method, the conductive elastic particles method, and the anisotropic conductive adhesives (ACAs) method. Nowadays, two variants of the conductive paste method are in commercial use. The most common approach uses a Pd-Ag paste, which reportedly provides a bonding resistance of less than 5 /spl Omega//electrode and a bond strength of 20 g/electrode. Heating the paste to approximately 150/spl deg/C reduces its adhesive strength enough to allow the drivers to be removed and rebonded. The second commercial method uses bumps that are not plated but formed with a two-stage ball-bonding technique. This process covers the Cu/Au stud-bump with a conductive paste and uses a zigzag formation that improves connection efficiency and allows a bond pitch of 7 /spl mu/m. In contrast to the approach using Pd-Ag paste, this technique typically uses silicon instead of epoxy for encapsulation.<>
Starting Page	199
Ending Page	202
File Size	633318
Page Count	4
File Format	PDF
ISBN	0780320379
DOI	10.1109/IEMT.1994.404666
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1994-09-12
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Liquid crystals Liquid crystal displays Bonding Costs Electrodes Flat panel displays Energy consumption Integrated circuit packaging Conducting materials Crystalline materials
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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