NDLI: Plastic separation planning enhancements from new laser identification technology and work measurement analysis

Content Provider	IEEE Xplore Digital Library
Author	Blyler, L. Tieman, L. Stuart, J.A. Duplaga, L. Meyer, N. Grant, E.
Copyright Year	2003
Description	Author affiliation: Sch. of Ind. Eng., Purdue Univ., West Lafayette, IN, USA (Blyler, L.; Tieman, L.; Stuart, J.A.)
Abstract	Recycling research strives to increase net revenues by evaluating the extent of disassembly, shredding, and materials separation. While many studies exist that help to clarify recycling potential of metals and glass from end-of-life electronics, much less is known from quantitative models about the optimal recovery of specific types of plastics from personal computers and printers. In this paper, we examine specifically the value relationship between the quantity of plastics separated and the time required for disassembly and segregation. Labor costs for disassembly can constitute a large portion of the total acquisition cost for a recycled material. We have conducted work measurement studies on the disassembly of 17 computers and three printers manufactured by ten producers in the years from 1986 to 1998. For each plastic part separated, we have calculated the weight per total separation time. Each recovered part was identified according to polymer resin using laser Raman spectroscopy by chemometric reference to a library of standards. We extrapolate the time as well as the product input required to accumulate specific types of plastic. As a result, we show how new laser identification technology and work measurement can be used for plastics separation planning.
Sponsorship	IEEE Comput. Soc., Tech. Committee on Electron. Environ. Int. Assoc. Electron. Recyclers
Starting Page	105
Ending Page	110
File Size	352437
Page Count	6
File Format	PDF
ISBN	0780377435
ISSN	10952020
DOI	10.1109/ISEE.2003.1208056
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2003-05-19
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Plastics Technology planning Recycling Printers Costs Computer aided manufacturing Chemical lasers Laser modes Optical materials Glass
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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