NDLI: Active disassembly using shape memory polymers for the mobile phone industry

Content Provider	IEEE Xplore Digital Library
Author	Chiodo, J.D. Billett, E.H. Harrison, D.J.
Copyright Year	1999
Description	Author affiliation: Brunel Univ., Uxbridge, UK (Chiodo, J.D.)
Abstract	This paper reports results the application of shape memory polymer (SMP) technology to the active disassembly of modern mobile phones. The smart material SMP of polyurethane (PU) composition was employed. Two different types of SMP fasteners were created for these experiments. With these smart material devices, it is possible for products to disassemble themselves at specific triggering temperatures at EoL. The two designs were compared for disassembly effectiveness. The disassembly technique is termed active disassembly using smart materials (ADSM), and has been successfully demonstrated on a variety of mobile phones. Whilst developed primarily as a universal disassembly technique, cost effectiveness and time performance is apparent. Heat sources of +90, +100 and a range of +67 to +120/spl deg/C were employed to raise the releasable fasteners above their trigger temperatures: in the case of SMP this would be the glass transition temperature (Tg). The development of releasable fasteners and applications in electronic products is described.
Starting Page	151
Ending Page	156
File Size	1060266
Page Count	6
File Format	PDF
ISBN	0780354958
DOI	10.1109/ISEE.1999.765867
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-05-13
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Shape Polymers Mobile handsets Plastics industry Fasteners Product design Temperature distribution Assembly Composite materials Costs
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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