NDLI: Abstract for a paper in the field of multi-chip modules to be presented by Marion Weigand and Neville Eilbeck

Content Provider	IEEE Xplore Digital Library
Author	Eilbeck, N.
Copyright Year	1992
Description	Author affiliation: Du Pont Electronics (Eilbeck, N.)
Abstract	Production of multichip modules using liquid polyimide dielectric coatings can be realised using two processing chemistries. The older non-photosensitive techniques involve the use of a photo sensitive layer to define the polyimide coating. Etching is accomplished at the develop stage in the process, piior to strip ping the photoresist. Today an increasing number of companies are using photodefinsable polyinides. These reduce dramatically the number of steps required to pattern the polyiside. The lithography required for both approaches is quite different and this leads to quite process specific techniques being re quired to optimise process throughput and yield. In this paper data will be presented showing the ability of the two processes to print defects at exposure and development. The ability to define the Critical Dimension will be explored and process latitude as a function of exposure and development will be discussed. The effect of these two parameters on mask specification will also be shown with a view to defining cost effective processes and materials. Results will be presented based on the use of the two most common substrate materials, ceramic and silicon., The stability of these two substrates will be linked to the physical properties of both types of polyinides, to provide an overall picture of today's processing technologies.
Starting Page	294
Ending Page	314
File Size	795341
Page Count	21
File Format	PDF
ISBN	0780306295
DOI	10.1109/IEMT.1992.763423
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1992-04-01
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Polyimides Plasma applications Coatings Europe Dielectric liquids Resists Dielectric substrates Wet etching Production Multichip modules
Content Type	Text
Resource Type	Article

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