NDLI: Compact modeling and analysis of coupling noise induced by through-Si-vias in 3-D ICs

Content Provider	IEEE Xplore Digital Library
Author	Chuan Xu Suaya, R. Banerjee, K.
Copyright Year	2010
Description	Author affiliation: Department of Electrical and Computer Engineering, University of California, Santa Barbara, 93106, USA (Chuan Xu; Banerjee, K.) \|\| D2S Division, Mentor Graphics Corporation, 38334 St. Ismier, France (Suaya, R.)
Abstract	Through-silicon vias (TSVs) in 3-D ICs, which are used for connecting different active layers, introduce an important source of coupling noise arising from electromagnetic (EM) coupling between TSVs and the active regions. This work, for the first time, presents compact models based on fully analytical approach for the EM coupling from a TSV to the active regions for a comprehensive set of 3-D IC substrate technologies including those with and without the high conductivity buried layer in dual-well bulk CMOS. The models can be used during design validation of emerging 3-D ICs. The compact physical models are verified against full-wave EM simulations. A comparative analysis of the magnitude of the EM-coupling noise for different 3-D technology scenarios, including both dual-well bulk CMOS and partially-depleted silicon-on-insulator (SOI) is also presented. The compact models presented for dual-well bulk CMOS are subsequently employed for estimating the stay-away radius (safe distance) from the center of the TSVs to the active regions to minimize the impact of such coupling noise.
File Size	388828
File Format	PDF
ISBN	9781442474185
ISSN	2156017X
e-ISBN	9781424474202
e-ISBN	9781424474196
DOI	10.1109/IEDM.2010.5703319
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-12-06
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Through-silicon vias Couplings CMOS integrated circuits Noise Silicon Semiconductor device modeling Conductivity
Content Type	Text
Resource Type	Article

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