NDLI: Hybrid FDTD-SPICE analysis of radiated emission from PCB with integrated circuits

Content Provider	IEEE Xplore Digital Library
Author	Nishizawa, A. Kobidze, G. Tanabe, S.
Copyright Year	2001
Description	Author affiliation: Adv. Technol. R&D Center, Mitsubishi Electr. Corp., Hyogo, Japan (Nishizawa, A.)
Abstract	The radiated emission from ground bouncing and transmission lines have been analyzed using the finite difference time domain (FDTD) and SPICE hybrid method. This method can consider both the nonlinear electric characteristics of IC and the distributed parameters of printed circuit boards (PCB). The computed results of the electric field at 3 m from the PCB were validated by the measurements. The hybrid tool allows calculation of the noise spectrum and radiation pattern. Another advantage is that this method can separate the contributions of various noise sources. This analysis tool and methodology is useful to design transmission lines and power/ground planes in PCB.
Starting Page	559
Ending Page	563
File Size	364342
Page Count	5
File Format	PDF
ISBN	0780365690
DOI	10.1109/ISEMC.2001.950704
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-08-13
Publisher Place	Canada
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Power transmission lines Finite difference methods Time domain analysis Distributed parameter circuits SPICE Electric variables Printed circuits Transmission line measurements Electric variables measurement Integrated circuit noise
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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Reduction of printed circuit board radiated emission

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