NDLI: Electrical performance of card-on-board interconnections for high-speed digital applications

Content Provider	IEEE Xplore Digital Library
Author	Deutsch, A. Surovic, C.W. Coteus, P.W. Cordes, M.J. Ridgeway, R.F.
Copyright Year	1994
Description	Author affiliation: Res. Div., IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA (Deutsch, A.)
Abstract	The continuing increase in circuit density and speed is placing an even greater burden on the electrical performance of intra-system interconnections. Both multiprocessor computer systems and communication networks are expected to require the propagation of 100 Mb/s-1 Gb/s type of data rates over lengths greater than 50 cm on relatively inexpensive card-on-board technologies. It is important to understand the key limiting factors and the directions needed for future development. In this paper we investigate the electrical performance of available high-density printed-circuit cards or boards and highlight the effect of skin-effect and dielectric losses. Several types of commercially available high-performance shielded pinned connectors for large size panels are modelled and their contributions to signal distortion and crosstalk are shown. The complete interconnection path starting from the driver circuit on one card and traversing representative board path to the receiver circuit on another card is analyzed and the practical extendibility limitations are discussed. Experimental results on specially built card and connector paths that emulate the actual use are compared with modelled waveforms.
Starting Page	23
Ending Page	26
File Size	339124
Page Count	4
File Format	PDF
ISBN	0780324110
DOI	10.1109/EPEP.1994.594055
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1994-11-02
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Dielectric losses Integrated circuit interconnections Connectors Wiring Copper Crosstalk Loss measurement Performance loss Packaging Attenuation
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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