NDLI: The impact of electrical field stress on the volume conductivity of syntactic foam

Content Provider	IEEE Xplore Digital Library
Author	Strauchs, A. Mashkin, A. Schnettler, A. Podlazly, J. Wandler, B.
Copyright Year	2010
Description	Author affiliation: Institute for High Voltage Technology, RWTH Aachen University, Germany (Strauchs, A.; Mashkin, A.; Schnettler, A.) \|\| Philips Medical Systems DMC GmbH, Hamburg, Germany (Podlazly, J.; Wandler, B.)
Abstract	This paper deals with the experimental investigation on the volume conductivity of syntactic foam, a new composite insulation material consisting of a epoxy resin matrix filled with hollow glass microspheres. This investigation focuses on the impact of high electrical field stress on the volume conductivity. Plate specimens of syntactic foam with a thickness of 3 mm are produced for the experiments. Hollow microspheres as well as solid microspheres are applied as filler. In addition, pure epoxy is used as a reference material during the measurements. The volume conductivities of the different specimens are determined by shield electrode configuration according to DIN IEC 60093 applying electrical fields up to 16 kV/mm dc. For each material and each voltage level a time resolved conductivity characteristic is recorded as a function of the load duration. Specimens with solid microspheres show a similar characteristic to the one of pure epoxy, while the behavior of the specimens with hollow microspheres differs. The results are discussed with regard to the filler types (hollow or solid). The impact of the cavity inside the filler on the conductivity and the time resolved measurement curve is shown. The main result of the investigations ascertains that the material behavior is not dominated by the presence of filler but by the presence of hollow filler. Finally, design recommendations for the use of syntactic foam in high voltage dc components are provided.
Starting Page	1
Ending Page	5
File Size	729956
Page Count	5
File Format	PDF
ISBN	9781424462988
ISSN	1089084X
e-ISBN	9781424463015
DOI	10.1109/ELINSL.2010.5549835
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-06-06
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Stress Conductivity Conducting materials Solids Voltage Insulation Composite materials Epoxy resins Glass Electrodes filled epoxy syntactic foam composite material conductivity high electrical field stress hollow microspheres
Content Type	Text
Resource Type	Article

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