NDLI: Electrochemical migration of land grid array sockets under highly accelerated stress conditions

Content Provider	IEEE Xplore Digital Library
Author	Shuang Yang Ji Wu Pecht, M.
Copyright Year	2005
Description	Author affiliation: CALCE Electron. Products & Syst. Center, Maryland Univ., College Park, MD, USA (Shuang Yang; Ji Wu; Pecht, M.)
Abstract	Land grid array sockets are used as separable interconnects between printed circuit boards and high I/O integrated circuit components. Metal-in-elastomer land grid array sockets consist of an array of elastomer contacts, a polyimide insulator and a thermoplastic frame. Silver particles are embedded in the silicone elastomer as contact medium to provide electrical paths between a printed circuit board and a component. In order to assess the reliability of this type of socket, biased, highly accelerated stress testing (HAST) was conducted. The surface insulation resistance (resistance between two adjacent contacts) was monitored, and was found to decrease significantly. Silver electrochemical migration (ECM) was identified as the cause. Both dendrites and film were observed on the polyimide insulator surface as a result of ECM. The dendrite grows from cathode contact to anode on the polyimide insulator surface. The ECM products were analyzed using both energy dispersive spectroscopy and X-ray photoelectron spectroscopy. Silver and silver oxides were detected as ECM products on the polyimide surface after HAST exposure. The potential chemical mechanism of silver electrochemical migration was described based upon the analysis of the ECM products.
Sponsorship	Components, Packaging and Manufacturing Technol. Soc. of the Instit. of Electr. and Electron. Eng. Inc
Starting Page	238
Ending Page	244
File Size	1092463
Page Count	7
File Format	PDF
ISBN	0780391136
DOI	10.1109/HOLM.2005.1518250
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-09-26
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Sockets Acceleration Silver Surface resistance Electrochemical machining Polyimides Insulation Contacts Thermal stresses Printed circuits
Content Type	Text
Resource Type	Article

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