NDLI: The ageing physics of electrical contacts subjected to DC current

Content Provider	IEEE Xplore Digital Library
Author	Oberg, A. Gustafsson, R. Saksvik, O. Stomberg, H. Olsson, K.-E.
Copyright Year	1996
Description	Author affiliation: ABB Corp. Res., Vasteras, Sweden (Oberg, A.)
Abstract	The ageing behaviour has been studied on a population of over 3000 connectors subjected to 1 kA DC for 10/sup 5/ hours. The metal combination in the contact interfaces was Aluminium to Nickel-plated (t=3 /spl mu/m) Copper. The contact resistances of the connectors were measured, and statistically evaluated. A number of contact surfaces were selected for metallographic examination and analysis. The findings were the following: The DC ageing behaviour of the connector type studied includes a slow ageing rate when the contact resistance is below 40 /spl mu//spl Omega/. Between 40 and 60 /spl mu//spl Omega/, the ageing rate increases dramatically for cathodic contacts, whereas it decreases for the anodic ones. Above 60 /spl mu//spl Omega/, cathodic contacts age even faster, including self-healing events. In this region, the anodic ageing rate approaches zero. In the transition region, the current density and temperature have increased to levels, for which onset of electromigration in cathodic a-spots by thermal diffusion can take place. In the high resistance region, electromigration will further increase the ageing rate. Due to the large differences in resistivity between Al/Ni intermetallics with very large and very small amounts of Ni, electromigration will only be triggered in cathodic contacts.
Starting Page	189
Ending Page	194
File Size	1057841
Page Count	6
File Format	PDF
ISBN	0780335783
DOI	10.1109/HOLM.1996.557196
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1996-09-16
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Aging Physics Connectors Electromigration Aluminum Copper Electrical resistance measurement Surface resistance Contact resistance Current density
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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