NDLI: Sputtering in vacuum: A technology for ultraclean metallization and space propulsion

Content Provider	IEEE Xplore Digital Library
Author	Anders, A. Andersson, J.
Copyright Year	2008
Description	Author affiliation: Lawrence Berkeley Nat. Lab., Berkeley, CA (Anders, A.; Andersson, J.)
Abstract	Sputtering is a well known coatings technology belonging to the group of physical vapor technologies. In contrast to cathodic arcs, sputtering can easily be scaled and does not produce the unwanted, ldquoinfamousrdquo macroparticles. Sputtering is conventionally done in the presence of a sputtering gas such as argon. For reactive deposition, argon is mixed with reactive gases such as nitrogen (for nitrides) or oxygen (for oxides). In this contribution we will report about a new development that allows sputtering in high or even ultrahigh vacuum to occur, without the addition of any gas at any time. This ldquogasless sputteringrdquo enables the deposition of ultra-clean metal coatings, in which even trace amounts of argon can be avoided. The key ldquoingredientsrdquo for gasless sputtering to work is (i) providing a short pulsed plasma flow aiming onto the magnetron target, and (ii) provide enough voltage (and power) to the magnetron that the discharge can run away into the so-called sustained self-sputtering (SSS) mode. We will describe the physical principles of operation, and outline further uses of the hardware, such as thrusters for space propulsion.
Starting Page	561
Ending Page	566
File Size	598450
Page Count	6
File Format	PDF
ISBN	9789737553829
ISSN	10932941
DOI	10.1109/DEIV.2008.4676856
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-09-15
Publisher Place	Romania
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Space technology Sputtering Vacuum technology Metallization Propulsion Argon Coatings Gases Nitrogen Plasmas
Content Type	Text
Resource Type	Article
Subject	Computer Networks and Communications Software

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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Discharges with the electrode homogeneously evaporated in vacuum (DEHEV)

Microthruster based on a low voltage vacuum spark

Arc plasma-assisted deposition of nanocrystalline coatings

On the motion of high current switching arcs in vacuum and low pressure gas

Breakdowns of vacuum interrupters behind front of a lightning impulse

Sputtering in vacuum: A technology for ultraclean metallization and space propulsion

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Sputtering in vacuum: A technology for ultraclean metallization and space propulsion