NDLI: Effects of inorganic component content on water absorbability and dielectric properties of the doped polyimide film

Content Provider	IEEE Xplore Digital Library
Author	Mang Mingyan Zhong Jinghe Fan Yong Jin Zhenhao
Copyright Year	2004
Abstract	In this article, nano-doped polyimide/Silica $(PI/SiO_{2})$ film was successfully prepared by the hydrolysis and condensation of methyl-triethoxysilane (MTEOS) that served as the precursor of the inorganic moiety and produced the nano-particle of silica in-situ in the polyamic acid (PAA) solution through sol-gel process. The chemical structure of the film was characterized by FTIR. The water absorbability and the dielectric properties including dielectric constant E and dielectric loss $t_{g}$ of the films were investigated with $SiO_{2}$ content. And E and $t_{g}$ θ of the films were, further, compared heforeafter the films were immersed in deionized water for 24 hours respectively. On the other hand, a certain kind of coupling agent was added in order to improve the compatibility. It turned out that the properties of the nano-doped materials were not only relative to the inorganic component content of the system, but also to the morphology of the phases and the character of interface. The water absorbability of the films decreased with $SiO_{2}$ content. And E and $t_{g}$ θof the films after immersed in water increased than those of the films before the immersion.
Starting Page	103
Ending Page	105
File Size	194499
Page Count	3
File Format	PDF
ISBN	078038461X
ISSN	10932941
DOI	10.1109/DEIV.2004.1418614
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-09-27
Publisher Place	Crimea
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Water Polyimides Dielectric losses Dielectric constant Chemical analysis Dielectric loss measurement Performance analysis Silicon compounds Inorganic materials Temperature
Content Type	Text
Resource Type	Article
Subject	Computer Networks and Communications Software

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