NDLI: Microfluidic platforms realized by micromachining and anodic bonding of Si and glass substrates

Content Provider	IEEE Xplore Digital Library
Author	Resnik, D. Aljancic, U. Vrtacnik, D. Mozek, M. Pecar, B. Amon, S.
Copyright Year	2012
Description	Author affiliation: University of Ljubljana, Faculty of Electrical Engineering, Laboratory of Microsensor Structures and Electronics, Tržaška 25 (Resnik, D.; Aljancic, U.; Vrtacnik, D.; Mozek, M.; Pecar, B.; Amon, S.)
Abstract	Presented work focuses mainly on issues accompanied with defect free anodic bonding of multilayer glass-Si-glass microfluidic structures. The problems associated with prefabricated structures which included micromachined or patterned topography on one or both of the mating surfaces and bonding to SiO2 terminated Si were investigated. In this study, Pyrex 7740 and Borofloat 33 glass wafers were bonded to bare Si and Si/SiO2 terminated structures in the temperature range 350–400 °C in the air ambient under applied anodic voltages between 800–1200V. Appropriate configuration of bonding electrodes was found mandatory to avoid debonding effects in multilayer bonding process. Wet etching of glass was used to fabricate microchannels and recessed structures in glass, which were subsequently anodically bonded to the cover glass via different intermediate layers. Thin intermediate Al layer was found to provide very uniform and stable bond between two glass wafers.
Starting Page	1
Ending Page	4
File Size	648561
Page Count	4
File Format	PDF
ISBN	9781457711169
e-ISBN	9781457711176
e-ISBN	9781457711152
DOI	10.1109/ICCDCS.2012.6188939
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-03-14
Publisher Place	Mexico
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Glass Bonding Silicon Substrates Surface treatment Microfluidics Microchannel microfluidics anodic bonding glass etching
Content Type	Text
Resource Type	Article

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