NDLI: Thermal-driven analog placement considering device matching

Content Provider	IEEE Xplore Digital Library
Author	Po-Hung Lin Hongbo Zhang Wong, M.D.F. Yao-Wen Chang
Copyright Year	2009
Description	Author affiliation: Dept. of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, USA (Hongbo Zhang; Wong, M.D.F.) \|\| Graduate Institute of Electronics Engineering, National Taiwan University, Taipei, Taiwan (Po-Hung Lin; Yao-Wen Chang)
Abstract	With the thermal effect, improper analog placements may degrade circuit performance because the thermal impact from power devices can affect electrical characteristics of the thermally-sensitive devices. There is not much previous work that considers the desired placement configuration between power and thermally-sensitive devices for a better thermal profile to reduce the thermally-induced mismatches. In this paper, we first introduce the properties of a desired thermal profile for better thermal matching of the matched devices. We then propose a thermal-driven analog placement methodology to achieve the desired thermal profile and to consider the best device matching under the thermal profile while satisfying the symmetry and the common-centroid constraints. Experimental results based on real analog circuits show that our approach can achieve the best analog circuit performance/accuracy with the least impact due to the thermal gradient, among existing works.
Starting Page	593
Ending Page	598
File Size	862498
Page Count	6
File Format	PDF
ISBN	9781605584973
ISSN	0738100X
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-07-26
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Association for Computing Machinery, Inc. (ACM)
Subject Keyword	Thermal engineering Radiofrequency amplifiers Radio frequency Power amplifiers Power engineering and energy Thermal degradation Circuit optimization Analog circuits Analog integrated circuits Algorithm design and analysis thermal matching Analog placement
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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