NDLI: The impact of embedded wafer level BGA package on the antenna performance

Content Provider	IEEE Xplore Digital Library
Author	PourMousavi, M. Wojnowski, M. Agethen, R. Weigel, R. Hagelauer, A.
Copyright Year	2013
Description	Author affiliation: Univ. of Erlangen-Nuremberg, Erlangen, Germany (PourMousavi, M.; Agethen, R.; Weigel, R.; Hagelauer, A.) \|\| Infineon Technol., Neubiberg, Germany (Wojnowski, M.)
Abstract	In this article, we present a study about the impact of embedded wafer level ball grid array (eWLB) on characteristics of antenna. The antenna in package is a promising solution for integration of antennas and eWLB technology enables integration of passive components and antennas into the redistribution layer (RDL). The antenna radiates perpendicular to the package in broadside into the package. There are different parameters such as size, shape, and thickness of the eWLB package which affect the radiation pattern significantly. Moreover, the materials properties of package like relative permittivity $(ε_{r})$ and loss tangent (tanδ) impact the impedance bandwidth, gain and efficiency of antenna and have to be taken into account. The other important parameter to design the antenna in package is the distance of antenna to the reflector. We present the feasibility of an antenna with backside metallization as an integrated reflector in an 8 mm × 8 mm eWLB package. The measurement and simulation results show that eWLB is an attractive candidate for mm-wave applications.
Starting Page	828
Ending Page	831
File Size	542549
Page Count	4
File Format	PDF
ISBN	9781467356893
DOI	10.1109/APWC.2013.6624913
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-09-09
Publisher Place	Italy
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Antenna measurements Reflector antennas Antenna radiation patterns Dipole antennas Loss measurement Frequency measurement millimeter wave radar eWLB package system-in-package integrated antenna antenna in package
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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