NDLI: Laser ablation patterning for low cost 3D die packaging

Content Provider	IEEE Xplore Digital Library
Author	Terrill, R.E.
Copyright Year	1997
Description	Author affiliation: Texas Instrum. Inc., Dallas, TX, USA (Terrill, R.E.)
Abstract	High cost has been the barrier in the wide spread application of high density 3D die packaging. Current industry technologies add $75 to $300 per die to provide packaged die in a 3D memory cube format. A novel patterning approach employing excimer laser ablation reduces the die reroute process and cube fabrication process steps by over two thirds. This reduces the estimated added cost to well under $25 per die. Two process developments were necessary to achieve this step function reduction in cost; a vapor deposited polyimide process and a thin film metal ablation process, both processes are accomplished on bare die. The vapor deposition polymerization process allows the formation of solventless films through vacuum co-evaporation of a dianhydride and diamine. The excimer laser ablation process is widely used to ablate vias in polyimide at a very high rate. Its use as a method of patterning thin film metal is atypical. Its use in patterning die on the face and edge in a single process set-up is unique. Results on using both processes to build inexpensive 3D memory products will be presented.
Starting Page	481
Ending Page	488
File Size	2145526
Page Count	8
File Format	PDF
ISBN	0780337417
DOI	10.1109/AERO.1997.574905
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-02-13
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Laser ablation Packaging Polyimides Polymer films Insulation Instruments Optical device fabrication Cost function Sputtering Transistors
Content Type	Text
Resource Type	Article

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