NDLI: Advanced analysis of dynamic neural control advisories for process optimization and parts maintenance

Content Provider	IEEE Xplore Digital Library
Author	Card, J.P. Chan, W.T. Cao, A. Martin, W. Morgan, J.
Copyright Year	2003
Description	Author affiliation: IBEX Process Technol. Inc., Lowell, MA, USA (Card, J.P.; Chan, W.T.; Cao, A.; Martin, W.)
Abstract	This paper details an advanced set of analyses designed to drive specific process variable setpoint adjustments or maintenance actions required for cost effective process control using the Dynamic Neural Controller/spl trade/ (DNC) wafer-to-wafer advisories for semiconductor manufacturing advanced process control. The new analytic displays and metrics are illustrated using data obtained on a LAM 4520XL at STMicroelectronics as part of a SEMATECH SPIT beta test evaluation. The DNC represents a comprehensive modeling environment that uses as its input extensive process chamber information and history of the time since maintenance actions occurred. The DNC uses a neural network to predict multiple quality output metrics and a closed-loop risk-based optimization to maximize process quality performance while minimizing overall cost of tool operation and machine downtime. The software responds in an advisory mode on a wafer-to-wafer basis as to the optimal actions to be taken. In this paper, we present three specific instances of patterns arising during wafer processing over time that signal the process or equipment engineer to the need for corrective action: either a process setpoint adjustment or specific maintenance actions. Based on the controller's recommended corrective action set with the overall risk reduction predicted by such actions, a metric of corrective action "urgency" can be created. The tracking of this metric over time yields different pattern types that signify a quantified need for a specific type of corrective action. Three basic urgency patterns are found: 1. a pattern in a given maintenance action over time showing increasing urgency or "risk reduction" capability for the action; 2. a pattern in a process variable specific to a given recipe indicating a chronic request over time to only adjust the variable setpoint either above or below the current target; 3. a pattern in a process variable existing over all recipes processed through the chamber indicating chronic request to adjust the variable setpoint in either or both directions over time. This pattern is a pointer to the need for a maintenance action that is either corroborated by the urgency graph for that maintenance action, or if no such action has been previously taken, a guide to the source of the equipment malfunction.
Sponsorship	IEEE Comput. Soc.
Starting Page	315
Ending Page	321
File Size	550782
Page Count	7
File Format	PDF
ISBN	0780376811
ISSN	10788743
DOI	10.1109/ASMC.2003.1194514
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2003-03-31
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Process control Risk management Costs Manufacturing processes Pulp manufacturing Semiconductor device manufacture Displays Testing Semiconductor device modeling History
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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